Allystar Attended ELEXON 2023

Author: Allystar
Released at: 2023-09-08 18:35
Readings: 96

Allystar, along with a series of self-developed chipsets and modules, was showcased at elexcon 2023 from August 23 to 25 in Shenzhen.

Themed “High-performance Computing and Low Power Consumption Witness PPA to Empower the Society with Intelligence”, the elexcon Shenzhen International Electronics Exhibition was debuting at the Shenzhen Convention and Exhibition Center (Futian) from August 23 to 25, 2023. With a massive display area of 60,000 square meters, this exhibition hosted over 600 top-tier global brands and manufacturers and attracted more than 50,000 professional visitors, showcasing industry innovations in the fields of electric vehicles, power and energy storage, embedded systems, AIoT, SiP, and advanced packaging. Additionally, there were more than 20 high-level forums offering insights into global industry trends and future technological advancements, especially in the automotive-grade semiconductor industry.

During the exhibition, Allystar and CEC Port (an industry-leading comprehensive service platform for component application innovation and supply chain) collaborated to present a range of chip-based BeiDou high-precision positioning industry solutions for the IoT sector. With the integration of billions of IoT devices into all walks of life, the transition from the IoT to the Internet of Everything has given rise to numerous innovative applications. Through chip technology research and development innovation, Allystar is contributing to the large-scale implementation of BeiDou services with the infiltration and consolidation of “BDS+” and “+BDS".

Since its establishment, Allystar has consistently enhanced the core technological capabilities of chip design, has been actively developing the BeiDou chips, and remained committed to highly integrated SoC design architecture that is based on advanced processes and innovative design concepts. This ensures that Allystar’s chips possess advantages in terms of positioning accuracy, performance, power consumption, cost, and size.

The exhibited products include HD8140, the latest generation of BeiDou chip independently developed by Allystar, the low-power flagship HD8120 series, as well as dual-band high precision positioning series HD8040D and HD9310, and the TAU series modules. These offerings find extensive applications in such fields as the IoT, wearable devices, vehicle navigation, and UAVs.

Looking ahead, Allystar will continue to drive the research and development of BeiDou chip technology, aiming to be conducive to the innovation and development of China's semiconductor and BeiDou industry chain, while promoting the broad adoption, mass application, and scale development of the BeiDou industry.

Recommended reading