The 27^th China International High-Tech Achievement Fair (CHTF), known as China’s primary sci-tech exhibition, grandly opened in Shenzhen at the Shenzhen World Exhibition & Convention Center in Bao’an on 14 November 2025. The event showcased a dazzling array of cutting-edge products and innovations that are set to invigorate the development of new quality productive forces.

Since its inauguration in 1999 with the approval of the State Council, CHTF has gathered tens of thousands of world-leading technologies and high-tech achievements. It has evolved into a premier global platform for displaying high-tech products, promoting brands, and an important window through which China can demonstrate its progress in the field of high technology. It is also an event at which global enterprises can showcase frontier technologies and share innovations.

This year’s event features 400,000 square meters of exhibition space, attracting over 5,000 enterprises from more than 100 countries and regions to present over 5,000 cutting-edge achievements. Longgang District has crafted a 270 square meters’ exhibition area to fully demonstrate its regional strengths. Focusing on the 14th Five-Year Plan and key sci-tech development fields, the stand showed products and technologies from leading enterprises in the district’s “20+8” industrial clusters, providing a comprehensive presentation of the results of Longgang’s innovation-driven development.

As a leading high-tech enterprise, Allystar presented its flagship products to demonstrate technological innovations and scenario applications in BeiDou chips. Allystar’s chip portfolio includes products in multiple categories, such as single-band low-consumption chips, dual-/multi-band sub-meter-level chips, multi-band centimeter-level positioning chips, and BDS-3 short message communication chips. All of these products are self-developed baseband-RF integrated SoC products supporting the BDS-3 signal system. These chips are adaptable to diverse scenarios, including smart wearables, shared mobility, highway passenger vehicles, tourist passenger vehicles, hazardous materials vehicles, buses, as well as other key operating vehicles, vehicle monitoring, and drones. They have been widely applied in consumer markets and key industries, with multiple products achieving a significant market share and generating millions of shipments. This has effectively advanced the BeiDou industry from technological leadership to large-scale application.

The newly launched HD6180 BDS-3 short message communication SoC chip, a self-developed baseband-RF integrated chip with independent intellectual property rights, marks a milestone in the mass adoption of BDS services. With the aim of popularizing BDS short messages, the HD6180 achieves significant advances in process, architecture, weak signal communication, satellite acquisition, decoding capability, and power consumption. Thanks to its advanced 22nm process and integrated RF transceiver architecture, it has a compact package and ultra-low power consumption below 22mW (approximately eight times lower than that of mainstream products). Its decoding sensitivity reaches -130 dBm, and the satellite acquisition takes less than 2 seconds. As the industry’s most advanced and smallest BDS-3 short message communication SoC chip, it not only provides superior chip-level solutions for such professional fields as emergency rescue, marine fisheries, and electric power data collection but also serves as the fundamental support for hundreds of millions of consumer devices, including smartphones and smart watches. While driving the development of a 10-billion-yuan upstream and downstream industrial chain, it is accelerating the integration of BDS short message technology from professional fields into daily life.

Looking ahead, Allystar will continue to be driven by technological innovation and will deepen its research and application of BeiDou chips. The company will also promote the in-depth integration and innovative application of BeiDou chips across various industries. Allystar is committed to contributing more to the high-quality development of China’s BDS industry and to building a more complete BDS industrial ecosystem by leveraging its strength in chips and related solutions.